Abstract: Due to the ongoing trend towards miniaturization of power components, the lossless thermal conductivity of solder joints in SMT-processes gains more and more importance. Therefore the role ...

Abstract: This article presents and discusses a method for evaluating the initiation of a solder joint delamination in a 3-D power electronics assembly of SiC MOSFETs integrated into printed circuit ...

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Meshtastic, an open-source firmware for long-range mesh networking, offers an elegant solution. Using LoRa radios allows ...